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AMD
Austin, Texas
Source: AMD careers · View original posting
From AMD's posting. “We” and “our” refer to the employer.
Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products. Successful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. He/she will be responsible for driving technology development initiatives from concept to qualifications.
Successful candidate would lead cross functional teams across geos in designing and developing novel package architectures and processes. He/she will be responsible for executive level communication on technology development progress, driving technical problem solving to address yield, reliability and process development challenges as needed. The candidate will also engage with worldwide ecosystem partners to gather data, analyze and identify solutions.
The candidate should have a proven track record of driving technology development in semiconductor field. He/she should have leadership experience driving engineering teams in architecture definition, process definition and/or yield improvement. The candidate should have excellent oral and written communication skills to share complex signals/recommendations with technology partners, colleagues, product architects and AMD management
Advanced packaging technology leader driving packaging architecture across client, server, gaming and GPU products. Successful candidate would collaborate with product design teams and technology development partners to understand future product needs and define a packaging roadmap that includes architecture, process definition, Design for Manufacturing (DFM) and Design for Yield (DFY) guidelines. He/she will be responsible for driving technology development initiatives from concept to qualifications.
Successful candidate would lead cross functional teams across geos in designing and developing novel package architectures and processes. He/she will be responsible for executive level communication on technology development progress, driving technical problem solving to address yield, reliability and process development challenges as needed. The candidate will also engage with worldwide ecosystem partners to gather data, analyze and identify solutions.
The candidate should have a proven track record of driving technology development in semiconductor field. He/she should have leadership experience driving engineering teams in architecture definition, process definition and/or yield improvement. The candidate should have excellent oral and written communication skills to share complex signals/recommendations with technology partners, colleagues, product architects and AMD management
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