Responsibilities
THE ROLE:
Join AMD's advanced packaging organization and help shape the mechanical architecture behind next-generation high-performance computing, AI, and semiconductor products. As a Principal Mechanical Engineer, you will lead the development of advanced package solutions spanning concept definition, mechanical design, simulation, qualification, and manufacturing ramp.
This is a highly visible technical leadership role that offers the opportunity to influence product direction, solve complex packaging challenges, and work across silicon, packaging, thermal, reliability, and manufacturing teams to bring industry-leading technologies to market.
THE PERSON:
The ideal candidate brings the technical depth of a principal-level individual contributor, the judgment of a senior engineering leader, and the hands-on capability to personally drive modeling, design reviews, supplier engagement, and problem resolution from concept through NPI, qualification, and production ramp. You enjoy solving complex problems, personally developing simulations and design solutions, mentoring engineers, and driving execution across cross-functional teams.
This position is especially suited for top-tier talent from semiconductor and high-performance hardware companies with strong experience in advanced packaging, mechanical design, mechanical stress simulation, and manufacturing execution who want to remain technically involved while also helping guide packaging strategy, engineering excellence, and future team growth.
Key Responsibilities
- Perform and lead mechanical architecture and design strategy for advanced semiconductor packaging solutions.
- Perform and drive mechanical design, CAD development, and thermo-mechanical analysis from concept through production.
- Perform and guide stress, warpage, reliability, and package-board interaction modeling using FEA tools.
- Partner with silicon, packaging, thermal, reliability, manufacturing, and supplier teams to optimize product performance and manufacturability.
- Conduct and lead qualification, failure analysis, and root-cause investigations across NPI and production.
- Establish design guidelines, mechanical specifications, and manufacturing requirements for advanced packaging technologies.
- Preferred Experience
- Hands-on expertise with ANSYS Mechanical, Creo, SolidWorks, and mechanical simulation workflows.
- Deep knowledge of thermo-mechanical reliability, stress analysis, warpage, and package-board interaction, including correlating simulations with DIC, shadow moiré, warpage metrology, strain gauges, thermal cycling data, cross-section analysis, acoustic microscopy, and failure analysis results.
- Advanced semiconductor packaging experience including flip-chip, chiplet, 2.5D/3D, interposer, or HBM-based architectures.
- Experience working with OSATs, foundries, substrate suppliers, and high-volume manufacturing partners.
- Strong understanding of package, substrate, PCB, and system-level mechanical integration.
- Proven technical leadership in complex semiconductor product development environments.
- ACADEMIC CREDENTIALS: MS or PhD in Mechanical Engineering, Materials Engineering, Electrical Engineering, Applied Mechanics, or a related technical field. Bachelors and equivalent industry experience may be considered.
- This role is not eligible for visa sponsorship.
Qualifications
