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AMD
Santa Clara, California
Source: AMD careers · View original posting
From AMD's posting. “We” and “our” refer to the employer.
We are seeking a highly experienced
Optical Interconnect System Integration and Qualification Engineer to lead system-level integration, validation, and qualification of next-generation optical and high-speed electrical interconnects for AI scale-out and scale-up platforms.
This role combines hands-on optical transceiver qualification with broader system integration responsibilities spanning optics, SerDes, signal integrity, power integrity, firmware, ASICs, boards, and complete platform architectures. The ideal candidate brings deep expertise in 400G, 800G, and emerging 1.6T optical interconnects, 100G and 200G per-lane PAM4 technologies, CMIS validation, SerDes optimization, lab characterization, and cross-functional system debug.
You will work closely with architecture, ASIC, SI/PI, diagnostics, firmware, platform engineering, and external vendor teams to drive qualification readiness, improve link performance, and influence future optical interconnect solutions including pluggable optics, onboard optics, co-packaged optics, and next-generation high-density system integration technologies.
The successful candidate is a hands-on technical leader with strong expertise in optical networking, high-speed electrical interconnects, and system qualification. You have a proven track record of driving complex cross-functional validation efforts, resolving challenging system-level issues, and delivering robust, production-ready interconnect solutions for next-generation AI and data center platforms.
You thrive in a fast-paced engineering environment, possess exceptional debugging and analytical skills, and can effectively communicate technical findings and recommendations across engineering organizations and leadership teams.
We are seeking a highly experienced
Optical Interconnect System Integration and Qualification Engineer to lead system-level integration, validation, and qualification of next-generation optical and high-speed electrical interconnects for AI scale-out and scale-up platforms.
This role combines hands-on optical transceiver qualification with broader system integration responsibilities spanning optics, SerDes, signal integrity, power integrity, firmware, ASICs, boards, and complete platform architectures. The ideal candidate brings deep expertise in 400G, 800G, and emerging 1.6T optical interconnects, 100G and 200G per-lane PAM4 technologies, CMIS validation, SerDes optimization, lab characterization, and cross-functional system debug.
You will work closely with architecture, ASIC, SI/PI, diagnostics, firmware, platform engineering, and external vendor teams to drive qualification readiness, improve link performance, and influence future optical interconnect solutions including pluggable optics, onboard optics, co-packaged optics, and next-generation high-density system integration technologies.
The successful candidate is a hands-on technical leader with strong expertise in optical networking, high-speed electrical interconnects, and system qualification. You have a proven track record of driving complex cross-functional validation efforts, resolving challenging system-level issues, and delivering robust, production-ready interconnect solutions for next-generation AI and data center platforms.
You thrive in a fast-paced engineering environment, possess exceptional debugging and analytical skills, and can effectively communicate technical findings and recommendations across engineering organizations and leadership teams.
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