Responsibilities
THE ROLE:
This position is responsible for Product Planning of next-generation AMD Adaptive and Embedded Computing products, with a focus on ASIC, SoC, FPGA, Adaptive SoC, and semi-custom product definition.
The role drives product strategy, roadmap planning, and product requirements by translating customer needs, market opportunities, business objectives, and engineering capabilities into actionable product definitions.
A significant aspect of this role is driving product requirements related to power efficiency, thermal performance, packaging, quality, reliability, manufacturability, and performance per watt.
The individual serves as a key technical and business point of contact across product planning, architecture, engineering, product engineering, packaging, quality, validation, manufacturing, marketing, and customer-facing teams.
The successful candidate will partner with engineering organizations to identify product-level opportunities and influence technical direction through requirements, customer insight, competitive analysis, and data-driven product planning rather than direct implementation ownership.
THE PERSON:
A successful candidate can independently drive product planning activities and influence technical decisions across multiple engineering organizations.
The ideal candidate combines strong technical understanding of semiconductor products, system architecture, and product development with the ability to translate customer needs, market trends, and technical constraints into structured product requirements.
The candidate understands how architecture, implementation, packaging, reliability, quality, manufacturing, validation, and thermal decisions affect overall product competitiveness and can effectively challenge assumptions, identify risks, and drive improved product outcomes through requirements and technical influence.
This role requires credibility with engineering organizations and the ability to engage deeply in technical discussions while maintaining a broader product, customer, and business perspective.
Comfort with ambiguity is essential. The candidate must be able to create structure, evaluate alternatives, and drive decisions when requirements, constraints, or priorities are not fully defined.
KEY RESPONSIBILITIES:
- Drive product planning activities for future ASIC, SoC, FPGA, Adaptive SoC, and semi-custom products.
- Gather and translate customer, market, business, and system requirements into product requirements, product definitions, and roadmap recommendations.
- Drive product requirements and planning activities across performance, power, thermal, quality, reliability, manufacturability, packaging, and performance-per-watt dimensions.
- Collaborate with architecture, design, product engineering, quality, validation, packaging, manufacturing, and business teams to ensure product requirements appropriately balance customer needs, product competitiveness, implementation complexity, and business objectives.
- Identify product-level risks and opportunities associated with power delivery, thermal solutions, packaging technologies, reliability targets, manufacturability, qualification, and quality objectives and ensure they are reflected in planning decisions.
- Influence technical direction through requirements development, customer and market analysis, competitive analysis, and cross-functional alignment.
- Work closely with engineering teams to challenge assumptions, evaluate alternatives, and improve overall product competitiveness through structured requirements and data-driven analysis.
- PREFERRED EXPERIENCE: 10+ years of relevant experience in semiconductor product development, system architecture, product planning, product management, technical marketing, applications engineering, product engineering, or related technical roles.
- Demonstrated experience influencing product, architecture, or engineering decisions through requirements development, technical analysis, customer engagement, or product planning.
- Strong understanding of semiconductor product tradeoffs involving performance, power, thermal management, packaging technologies, quality, reliability, manufacturability, cost, and time-to-market.
- Experience defining product requirements, platform requirements, roadmap strategies, product planning inputs, or product investment recommendations.
- Experience working with FPGA, Adaptive SoC, ASIC, CPU, GPU, AI accelerator, networking, communications, embedded, or semi-custom semiconductor products.
- Experience working across architecture, engineering, product engineering, validation, manufacturing, packaging, and quality organizations.
- ACADEMIC CREDENTIALS: Bachelor’s or Master’s degree in Electrical Engineering, Computer Engineering, Computer Science, or related discipline.
- This role is not eligible for visa sponsorship.
Qualifications
