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Intel
US, Arizona, Phoenix; USA - AZ - Chandler; US, Oregon, Hillsboro
Source: Intel careers · View original posting
From Intel's posting. “We” and “our” refer to the employer.
Intel Technology Research is advancing the future of AI and high-performance computing through innovative advanced packaging technologies and 3D heterogeneous integration. Enabling novel system architecture, developing innovating process integration and establishing predictive physics-based simulation capabilities are critical for enabling complex large form factor packages with high-bandwidth interconnect.
As an Advanced Packaging Integration and Simulation Intern, you will collaborate with leading researchers, process engineers, and modeling experts to develop and assess next-generation package architectures. In this role, you will contribute to advanced Research and Dev across package integration, process flow definition and development, package modeling, yield and reliability assessment, and data analytics.
Gain hands-on exposure to advanced packaging integration challenges that enable future semiconductor technologies.
Learn how process integration, material selection, design rules, metrology, and package architecture interact to drive yield and reliability.
Develop practical experience with developing package simulation, model validation, and data-driven engineering analysis.
Gain exposure to advanced packaging architectures, including chiplets, 2.5D/3D integration, wafer-level assembly, and industrial leading interconnect technologies.
Participate in technical reviews, technology forums, and intern research presentations with experienced engineers and researchers.
Annual Salary Range for jobs which could be performed in the US: $120,898.00-120,902.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Our standard internship rates are based on your degree, location, and the job role. Your recruiter can share more about the specific compensation range for your preferred location and job role during the hiring process.
Work Model for this Role
This role will be eligible for our hybrid work model which allows employees to split their time between working on-site at their assigned Intel site and off-site. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
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