layiq
/la·yiq/adjective
worthy; deserving; fitting; suitable.
A role, opportunity, or path that merits attention, time, and pursuit.
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Job opportunity
Packaging Module Development Engineer
Intel
US, Arizona, Phoenix; USA - AZ - Chandler
Source: Intel careers · View original posting
- Pay
- Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD
- Employment
- full time
Employer job description
From Intel's posting. “We” and “our” refer to the employer.
Job Details:
Job Description:
The Advanced Packaging Technology and Manufacturing (APTM) organization is seeking a Metrology Equipment Engineer to drive process control, manufacturing data analytics, and yield improvement for Thermal Compression Bonding (TCB) technologies.
The successful candidate develops and sustains metrology systems, measurement methods, and inspection equipment to support Intel’s roadmap for advanced packaging and Thermal Compression Bonding technologies. They apply engineering principles and novel concepts to deliver measurement solutions that improve process control, product quality, reliability, productivity, yield, and manufacturability.