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AMD
Austin, Texas
Source: AMD careers · View original posting
From AMD's posting. “We” and “our” refer to the employer.
ADVANCE YOUR CAREER. ADVANCE THE WORLD.
At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.
Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.
As part of the AMD's Advanced Packaging team, you will drive technology development of advanced 3D package architectures. The scope includes but not limited to: execute and coordinate proof of concept on new technology; product bring up and continue yield and reliability improvement to meet performance, cost, and schedule requirements to support new AMD products.
THE PERSON
The candidate should have a proven track record and extensive knowledge and experience in wafer process Integration, such as BEOL Integration, 3D integration with TSV (through silicon via) and Hybrid Bonding (CoW and W2W) etc. The candidate should have a hands-on approach to process bring up and development as well as excellent oral and written communication skills to communicate ideas with Foundry Partners, Suppliers, Internal Stakeholders and AMD Management.
As part of the AMD's Advanced Packaging team, you will drive technology development of advanced 3D package architectures. The scope includes but not limited to: execute and coordinate proof of concept on new technology; product bring up and continue yield and reliability improvement to meet performance, cost, and schedule requirements to support new AMD products.
THE PERSON
The candidate should have a proven track record and extensive knowledge and experience in wafer process Integration, such as BEOL Integration, 3D integration with TSV (through silicon via) and Hybrid Bonding (CoW and W2W) etc. The candidate should have a hands-on approach to process bring up and development as well as excellent oral and written communication skills to communicate ideas with Foundry Partners, Suppliers, Internal Stakeholders and AMD Management.
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