Staff / Principal Wafer Bond Process Development Engineer

Our vision is to transform how the world uses information to enrich life for all .

Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.

In your role as a Staff / Principal Wafer Bonding Process Engineer within Micron Technology's DRAM Technology Development group, you will join a worldwide memory development organization. You will contribute to developing modern wafer bonding process technology that keeps Micron at the forefront of memory technology. This position is important because it directly affects product quality, reliability, yield, cost savings, efficiency, and risk control.

You will initiate, develop, and fine-tune bonding processes while addressing manufacturing line challenges. You will also manage process, equipment, and material evaluations and improvements to apply changes at various process steps. Your duties include leading and engaging in activities to improve yield and reduce costs, overseeing new process baseline qualifications, and collaborating with suppliers to achieve quality, cost, and risk objectives. You will use AI/ML/LLM tools to boost efficiency and maintain flawless operations.