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Amazon
San Diego, CA
Source: Amazon careers · View original posting
From Amazon's posting. “We” and “our” refer to the employer.
Amazon Leo is an initiative to launch a constellation of Low Earth Orbit satellites that will provide low-latency, high-speed broadband connectivity to unserved and underserved communities around the world.
Come work at Amazon!
As an IC Packaging Design Engineer, you will engage with an experienced cross-disciplinary staff to conceive and design innovative product solutions. You will work closely with an internal inter-disciplinary team, and third-party suppliers to drive key aspects of product definition, execution and optimization. You must be responsive, flexible and able to succeed within an open collaborative peer environment.
As a member of the packaging team, you will be responsible for package design for mm-wave beamforming SoCs and front-end modules. Strong focus will be on creating the most power optimized solution for a given system performance.
Export Control Requirement
Due to applicable export control laws and regulations, candidates must be a U.S. citizen or national, U.S. permanent resident (i.e., current Green Card holder), or lawfully admitted into the U.S. as a refugee or granted asylum.
Key job responsibilities
Collaborate with digital design, and RF chip designers define floorplans, bump maps, and ball maps for beamforming ICs.
Work with package vendors on stack-ups, materials selection, package options, and thermal testing/design.
Analyze cost/performance trade-offs, and complete layout of package types such as FCBGA, FCCSP, WLCSP, QFN, etc.
Setup and run 3D electromagnetic simulations of package + PCB in tools such as HFSS and Momentum to verify your designs.
Perform signal integrity checks and create models for packages to identify issues like crosstalk and coupling.
Assist the thermal team in defining and running thermal simulations of packages and PCBs.
Collaborate with the Antenna and EE teams to design and layout test and application PCBs for your packages.
Advise on qualification of packages: HAST, HTOL, board level reliability, etc.
Define and implement AI-driven workflows for packaging design, leveraging automation and machine learning to accelerate design iterations and optimize performance.
The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location.
Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.
USA, CA, San Diego - 153,600.00 - 215,000.00 USD annually
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