layiq

/la·yiq/adjective

worthy; deserving; fitting; suitable.

A role, opportunity, or path that merits attention, time, and pursuit.

Process Integration Engineer at Absolics Inc | LAYIQ

Oversee process integration, manage scheduling, and provide comprehensive progress reports to upper management.
Develop and implement process integration strategies to optimize production yield and efficiency.
Coordinate with cross-functional teams to ensure seamless integration of processes.
Monitor and analyze process performance, identifying areas for improvement.
Ensure compliance with industry standards and safety regulations.
Troubleshoot and resolve process-related issues in a timely manner.
Maintain detailed documentation of processes and procedures.
Generate innovative ideas for patent filings.
Required Skills: Demonstrated experience integrating multi-step package build up process flows (SAP and/or damascene), from lithography through metallization and dielectric build-up
Strong working knowledge across the full unit-process stack: photolithography, wet/dry etch, PVD seed deposition, dielectric film processing, and electroplating, sufficient to identify cross-process interactions and failure handoffs
Experience authoring or owning Process Integration Plans, design rules (line/space, via CD, registration/overlay budgets, taper angle specs), and process flow documentation
Track record of root-causing yield or reliability excursions that span multiple process modules (e.g., seed undercut driving downstream plating defects, via CD variation driving lithography-etch mismatch)
Statistical process control and DOE methodology for multi-variable, multi-step process optimization
Strong cross-functional collaboration skills; ability to translate unit-process engineer findings into integration-level decisions and vice versa
Familiarity with metrology and failure analysis techniques across the flow (SEM, FIB cross-section, CD-SEM, overlay metrology, electrical test)
Understanding of registration, overlay, and CD budget allocation across sequential build-up layers
Fluent in English; proficiency in Korean is a plus.
Preferred Skills
Experience with glass core substrates
Direct experience scaling fine line/space RDL, including via CD control and multi-layer registration challenges
Experience with any next-gen architecture enablement: glass core/glass interposer integration, panel-level processing, co-packaged optics, hybrid bonding, or fan-out heterogeneous integration
Familiarity with bifurcated roadmap considerations (high-performance AI/HPC vs. cost-optimized mainstream paths) and how that shapes architecture and material tradeoffs
Experience building DFM (design-for-manufacturing) guidelines in collaboration with package design teams
Knowledge of reliability qualification frameworks (JEDEC, IPC) as they constrain integration choices
Familiarity with new equipment or process technology evaluation and incorporation into an existing flow (e.g., panel-level CMP, advanced laser/plasma drill, novel dielectric chemistries)
Experience presenting integration roadmaps or technical reviews to leadership or cross-functional stakeholders
Publication, patent, or conference presentation record (e.g., ECTC) in RDL/interconnect integration
Education
Ph.D. in Materials Science, Electrical Engineering, Chemical Engineering, or related field preferred
M.S. with 5+ years of relevant process integration or process engineering experience considered (integration roles typically warrant a higher experience bar than single-unit-process roles)

Process Integration Engineer

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