Advanced Packaging Technologist (Mechanical Modeling)

ADVANCE YOUR CAREER. ADVANCE THE WORLD.

At AMD, we believe technology has the power to solve the world’s most important challenges. From advancing healthcare and scientific discovery to powering AI and the technologies people rely on every day, innovation at AMD is shaping the future.

Whether you’re designing next-gen processors, enabling AI breakthroughs, or bringing leading edge products to market, every role at AMD contributes to something bigger — technology that moves the world forward. Join us and, together, we’ll advance your career.

THE ROLE:

In this role, you will serve as a Package-centric Mechanical Modeling Architect responsible for defining and driving next-generation packaging-platform architectures through rigorous, model-based decision making and System-Technology Co-Optimization (STCO). You will develop, validate, and apply mechanical and multi-physics models to guide package/board-level architecture, technology selection and integration of electro-thermal and electro-optical capabilities across package, board, and cooling solutions.

THE PERSON:

The ideal candidate is a self-directed technical leader who operates with a high degree of autonomy, communicates with clarity, and collaborates effectively across silicon, package, board, thermal, optical, mechanical, manufacturing, and system architecture teams. You are comfortable owning both the modeling rigor and experimental grounding required for advanced package architecture & design decisions and influence product and platform roadmaps for data center and high-performance computing systems.