layiq

/la·yiq/adjective

worthy; deserving; fitting; suitable.

A role, opportunity, or path that merits attention, time, and pursuit.

Advanced Packaging Module Development Engineer at Intel | LAYIQ

Technology Development & Enablement: Drive technology development for high-volume manufacturing and future technology nodes, providing process integration and equipment solutions to meet desired device specifications.
Process Design & Development: Lead the design and development of technically sophisticated manufacturing processes, including material selection, parameter optimization, equipment metrology, and system design to enable new product designs and functional requirements.
Pathfinding & Roadmap Development: Perform pathfinding activities in support of process and hardware development, enabling the manufacturing of innovative device architectures, and develop technology roadmaps for future product generations.
Manufacturing Optimization: Recommend and implement modifications to operating equipment to improve production efficiency, refine manufacturing techniques, and optimize production output for existing products.
Supplier Collaboration: Partner with key equipment and materials suppliers to develop and implement enabling elements of technology, building cost-sensitive roadmaps in collaboration with the vendor ecosystem.
Feasibility Studies: Perform process technology feasibility studies through theoretical simulations and practical engineering methods to validate new approaches and technologies.
Industry Awareness: Remain current on relevant industrial process and material manufacturing technical trends, developing a forward-looking view of Intel's future process technology needs to push the industry forward.
Statistical Analysis & Experimentation: Apply Statistical Process Control (SPC) and Design of Experiments (DOE) principles to drive data-informed decisions and process improvements.
Automation & Systems Development: Leverage hands-on experience with robotics, automation systems, vision systems, and image processing to advance manufacturing capabilities.
As a Successful Candidate, You Will Bring: A Natural Problem-Solver: You thrive when faced with complex challenges and approach them with creativity, curiosity, and a structured mindset.
Adaptable & Resilient: You embrace change and ambiguity, pivoting quickly when priorities shift without losing momentum or focus.
A Collaborative Team Player: You build strong relationships across teams, functions, and supplier ecosystems, knowing that the best outcomes come from working together.
An Effective Communicator: You can translate complex technical concepts into clear, actionable insights for diverse audiences, from engineers to leadership.
Self-Motivated & Driven: You take ownership of your work, proactively seek out opportunities to improve processes, and are passionate about making a meaningful impact.
Detail-Oriented: You bring precision and rigor to everything you do, understanding that in semiconductor manufacturing, the smallest details can make the biggest difference.
Innovative & Forward-Thinking: You are passionate about staying ahead of industry trends and are energized by the opportunity to shape the future of semiconductor technology.
Are you ready to be part of a team that is literally building the future? At Intel's Hillsboro, Oregon campus, you'll have the resources, the talent, and the mission to do work that truly matters — not just for Intel, but for the world.

Advanced Packaging Module Development Engineer

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