layiq
/la·yiq/adjective
worthy; deserving; fitting; suitable.
A role, opportunity, or path that merits attention, time, and pursuit.
Loading LAYIQ…
Job opportunity
Substrate Packaging Research and Development Engineer
Intel
US, Arizona, Phoenix; USA - AZ - Chandler
Source: Intel careers · View original posting
- Pay
- Annual Salary Range for jobs which could be performed in the US: $133,800.00-188,890.00 USD
- Employment
- full time
Employer job description
From Intel's posting. “We” and “our” refer to the employer.
Job Details:
Job Description:
As a Packaging Module Development Engineer, you will play a vital role in advancing Intel's semiconductor manufacturing capabilities by developing innovative packaging processes and equipment. Your day-to-day responsibilities will focus on optimizing assembly methods to achieve quality, reliability, and efficiency goals in high-volume manufacturing environments.