From Amazon's posting. “We” and “our” refer to the employer.
The Annapurna AI Manufacturing, Quality and Reliability (MQR) team is part of AWS Annapurna Labs, building the AI platforms that power the world's largest cloud. We take custom silicon from design through high-volume production across multiple ODM and JDM partners in Asia and North America, at a ramp rate and scale that leaves no room to inspect quality in after the fact.
We are looking a Senior Manufacturing Engineer to own Design for Manufacturability and manufacturing automation across our accelerator card, baseboard, and rack programs. Your job is to move quality upstream: make the design manufacturable before the drawing is released, and make the line capable of building and verifying it without manual intervention.
You will sit between hardware design, component suppliers, and ODM process engineering. You will review designs for tolerance capability, land pattern and stencil design, connector retention and insertion, part accessibility, handling, and serviceability — and you will hold the line when a design is not buildable at the yield and rate the program requires.
You will then own the automation and metrology strategy that makes the resulting process observable: automated inspection, in-line measurement, fixture design, and the data capture behind it.
Key job responsibilities
Design for Manufacturability
Own DFM, DFA, and DFT review as a gate prior to drawing release and prior to NPI build, across accelerator cards, baseboards, power distribution, interconnect, and rack-level assembly.
Perform tolerance stack-up and GD&T analysis, and establish tolerances that a partner factory can hold at Cpk ≥ 1.33 at volume — not tolerances that are theoretically correct and practically unachievable.
Reconcile component supplier specifications against AWS drawings before release, and resolve conflicts where a supplier's requirement is tighter than the drawing allows.
Design process margin into the product: solder paste volume against land pattern and via structure, insertion force windows, retention features, and clearance for automated handling.
Provide design feedback on connector retention, contact-level defect modes, fastener and cable access, and serviceability in the rack.
Build and maintain a versioned DFM design-rule set that carries across product generations, so each program does not relearn the same lessons.
Manufacturing Automation and Metrology
Own the automated inspection and in-line measurement strategy — SPI, AOI, AXI, ICT, vision, and dimensional or true-position measurement — including whether each system is capable of detecting the defect it is deployed against.
Drive measurement system analysis across partners: gauge design, gauge R&R, correlation between AWS and supplier measurement, and elimination of methodology differences that make cross-site data non-comparable.
Specify and deploy automation that removes manual handling and manual data collection from the line, and automate the capture of measurement and process data into SPC.
Own test fixture and tooling design, calibration, and health management, including detection of fixtures that induce false failures.
Assess new ODM lines and new sites for process capability before qualification, and define the equipment and process requirements to close gaps.
Program and Partner Execution
Partner with hardware and silicon design teams during development to influence the design while influence is still cheap.
Work directly with ODM and JDM process engineering at multiple sites to implement process changes, and verify in production that they held.
Drive design and process changes through DCN and ECN, including propagation across all build sites.
Build mechanisms — control plans, capability studies, design-rule checks, runbooks — that continue to work at sites you are not present at.
About the team
Annapurna Labs is a wholly owned subsidiary of AWS, focused on developing custom silicon and servers including the Nitro, Graviton, Inferentia, and Trainium families of processors. Machine Learning Annapurna (MLA) functions as a vertically integrated team including software, firmware, hardware, and silicon design in a single organization. We are the Annapurna AI Servers and Systems organization under MLA, focused on Hardware Development, Software Development, Fleet Ops Systems, and Manufacturing, Quality, and Reliability.
This position is in the Manufacturing, Quality and Reliability team.
Basic Qualifications
Bachelor's degree in Mechanical, Electrical, Manufacturing, or Industrial Engineering
7+ years of manufacturing engineering experience on high-volume electronics or server hardware, including ownership of Design for Manufacturability
Experience with SMT/PCBA manufacturing and system-level assembly at a contract manufacturer, ODM, or JDM
Experience with tolerance analysis and GD&T, and with establishing manufacturable tolerances validated by process capability data
Experience specifying or deploying automated inspection or manufacturing automation on a production line
Experience influencing hardware design teams to change a design for manufacturability reasons
Willingness and ability to travel internationally to partner manufacturing sites
Preferred Qualifications
Master's degree in Mechanical or Electrical Engineering or a related field
Experience with server, storage, networking, or large-scale distributed systems
Experience in high-volume manufacturing operations or sourcing environments
Experience with robotics work cells and their control systems, or experience working with electrical and mechanical conveyance systems
Knowledge of project management tools and software
Experience working with overseas partners
Depth in SMT process: stencil and land pattern design, paste volume and SPI, reflow profiling, placement equipment, via-in-pad and VIPPO structures
Depth in press-fit and connector processes, including insertion force, retention, and contact-level defect modes
Metrology and MSA depth: gauge R&R, true position measurement, laser 3D scanning, CMM, optical measurement, Cpk and SPC
Working knowledge of IPC standards (IPC-A-610, IPC-7351, IPC-A-600, IPC/WHMA-A-620) and J-STD-001
DFMEA, PFMEA, control plan, and 8D experience
Demonstrated ability to uncover systemic manufacturability issues prior to NPI
Meets/exceeds Amazon's leadership principles requirements for this role
Meets/exceeds Amazon's functional/technical depth and complexity for this role
Equal Opportunity
Amazon is an equal opportunity employer and does not discriminate on the basis of protected veteran status, disability, or other legally protected status.
Our inclusive culture empowers Amazonians to deliver the best results for our customers. If you have a disability and need a workplace accommodation or adjustment during the application and hiring process, including support for the interview or onboarding process, please visit https://amazon.jobs/content/en/how-we-hire/accommodations for more information. If the country/region you’re applying in isn’t listed, please contact your Recruiting Partner.
The base salary range for this position is listed below. Your Amazon package will include sign-on payments and restricted stock units (RSUs). Final compensation will be determined based on factors including experience, qualifications, and location.
Amazon also offers comprehensive benefits including health insurance (medical, dental, vision, prescription, Basic Life & AD&D insurance and option for Supplemental life plans, EAP, Mental Health Support, Medical Advice Line, Flexible Spending Accounts, Adoption and Surrogacy Reimbursement coverage), 401(k) matching, paid time off, and parental leave. Learn more about our benefits at https://amazon.jobs/en/benefits.
USA, TX, Austin - 159,200.00 - 215,300.00 USD annually
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