Responsibilities
- As an AMD intern or co-op, you’ll be placed at the epicenter of the AI ecosystem, working alongside experts and industry pioneers. You’ll do important work, learn new skills, expand your network, and gain real-world experience on projects that impact millions of end-users worldwide. Whether you’re an undergrad or a PhD student, your contributions matter—and your experience here will be a launchpad for what comes next.
JOB DETAILS:
Location:
Santa Clara, CA
Onsite/Hybrid:
This role requires the student to work full time (40 hours a week), in a hybrid, onsite, or remote work structure throughout the duration of the co-op/internship term.
Duration:
Spring/Summer Co-op:
January 25, 2027 – August 13, 2027
Summer Internship
Semester Schools:
May 24, 2027 – August 13, 2027
Quarter Schools:
June 21, 2027 – September 10, 2027
Summer/Fall Co-op
Semester Schools:
May 24, 2027 – December 10, 2027
Quarter Schools:
June 21, 2027 – December 10, 2027
WHAT YOU WILL BE DOING:
We are seeking highly motivated Thermal Engineering interns/co-ops to join our teams and support the development of advanced cooling technologies for AI, high-performance computing, and data center platforms. In this role –
We will involve you in the thermal and hydraulic characterization of cooling solutions, including cold plates, manifolds, heat exchangers, coolant loops, and rack-level cooling systems.
We will provide opportunities for you to evaluate air-cooled and liquid-cooled platforms through thermal, airflow, coolant-flow, and pressure-drop analysis activities.
We will train you to support laboratory testing, instrumentation setup, sensor deployment, data acquisition, and thermal validation activities.
We will encourage you to develop scripts and tools that automate test execution, data processing, engineering analysis, and reporting activities.
We will assign projects involving thermal modeling, simulation, and comparison of measured data against design expectations to help identify trends and support performance improvements.
We will have your involvement in investigating thermal, flow, and power-related issues and working with engineering teams to identify effective solutions.
We will encourage you to document technical findings and communicate results through engineering reports, presentations, and technical documentation.
WHO WE ARE LOOKING FOR:
You are currently enrolled in a U.S.-based university pursuing a Bachelor's degree in Mechanical Engineering, Aerospace Engineering, Thermal Sciences, or a related engineering discipline.
If you have knowledge or experience with any of the following technical skills (or related areas) and are enthusiastic about this role, we strongly encourage you to apply –
Heat transfer, thermodynamics, fluid mechanics, thermal-fluid systems, or engineering analysis.
Thermal management solutions, liquid cooling technologies, electronics cooling concepts, cold plates, heat exchangers, thermal interface materials, airflow management, or coolant flow systems.
Laboratory testing, instrumentation, sensors, thermal characterization, data acquisition systems, or experimental validation methodologies.
CAD software such as SolidWorks or Creo.
CFD software, thermal simulation tools, or engineering analysis software including ANSYS Icepak, Fluent, FloTHERM, COMSOL, OpenFOAM, or similar tools.
Analytical, problem-solving, communication, and technical documentation skills.
Exposure to AI infrastructure, high-performance computing systems, server technologies, data center platforms, or energy-efficient cooling technologies is a plus.
Note:
This role is not eligible for visa sponsorship.
Qualifications
