layiq
/la·yiq/adjective
worthy; deserving; fitting; suitable.
A role, opportunity, or path that merits attention, time, and pursuit.
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Intel Jobs
- 349 current openings, updated from employer postings.
- Median listed pay: $128,880–$219,550 a year, from 304 postings that list annual pay.
- 4 are remote (1%).
Page 7 of 14, newest first.
- NMSI F11X Thin Films Module Engineer-Technologist
US, New Mexico, Albuquerque; USA - NM - Rio Rancho
- Software Development Engineer
US, California, Folsom; USA - CA - Folsom; US, Oregon, Hillsboro; US, California, Santa Clara; US, Arizona, Phoenix
- Senior PDK Support Engineer (Physical Verification)
US, California, Santa Clara; USA - CA - Santa Clara; US, Arizona, Phoenix; US, Oregon, Hillsboro
- Senior Member of Technical Staff, Thin Films Engineer
US, Oregon, Hillsboro; USA - OR - Hillsboro; US, Arizona, Phoenix
- Federal Program Associate - Intel Contract Employee
US, Arizona, Phoenix; USA - AZ - Chandler; US, Oregon, Hillsboro
- Parametric Test Module Intern
US, Oregon, Hillsboro; USA - OR - Hillsboro
- New Mexico Site Automation Integrator
US, New Mexico, Albuquerque; USA - NM - Rio Rancho
- Materials Research Engineer
US, Oregon, Hillsboro; USA - OR - Hillsboro
- Substrate Quality and Reliability Engineer
US, Arizona, Phoenix; USA - AZ - Chandler
- Ocotillo Technology Fabrication Dry Etch Module Equipment Technician (Entry-level)
US, Arizona, Phoenix; USA - AZ - Chandler
- Module Engineering PhD Intern - Wet Etch
US, Oregon, Hillsboro; USA - OR - Hillsboro
- Module Engineering PhD Intern
US, Oregon, Hillsboro; USA - OR - Hillsboro
- Module Engineering PhD Intern
US, Oregon, Hillsboro; USA - OR - Hillsboro
- Facilities Mechanical Technician ICE
US, Oregon, Hillsboro; USA - OR - Aloha
- Substrate Supplier Enablement Engineer
US, Arizona, Phoenix; USA - AZ - Chandler
- Semiconductor Packaging Research Engineer
US, Arizona, Phoenix; USA - AZ - Chandler; US, Oregon, Hillsboro
- ATD MIHL Equipment Development Engineer
US, Arizona, Phoenix; USA - AZ - Chandler
- Packaging Module Development Engineer
US, Arizona, Phoenix; USA - AZ - Chandler
- Software Research Engineering - (PhD Intern)
US, Oregon, Hillsboro; USA - OR - Hillsboro
- Advanced Packaging Integration and Simulation Intern
US, Arizona, Phoenix; USA - AZ - Chandler; US, Oregon, Hillsboro
- Module Engineering PhD Intern 2027
US, Oregon, Hillsboro; USA - OR - Hillsboro
- WLA-NM Module Equipment Contract Technician
US, New Mexico, Albuquerque; USA - NM - Rio Rancho
- Quantum Cryoprober Engineer
US, Oregon, Hillsboro; USA - OR - Hillsboro
- Silicon SoC Architect
US, California, Santa Clara; USA - CA - Santa Clara; US, Colorado, Fort Collins; US, Massachusetts, Beaver Brook; US, Oregon, Hillsboro; US, California, Folsom…
- Semiconductor Research Integration Engineer
US, Oregon, Hillsboro; USA - OR - Hillsboro