layiq

/la·yiq/adjective

worthy; deserving; fitting; suitable.

A role, opportunity, or path that merits attention, time, and pursuit.

LAYIQ - Packaging Process Development Engineer at Intel

Develop and optimize assembly media and collaterals to achieve quality, reliability, cost, yield, productivity, and manufacturability targets.
Apply Design of Experiments (DOE) and Statistical Process Control (SPC) principles to refine media and collateral capabilities, documenting findings through detailed technical reports.
Design and maintain equipment to evaluate media and collateral performance under simulated field conditions, including temperature cycles, heat, humidity, and dynamic mechanical forces.
Ensure manufacturability of physical prototypes and oversee the full lifecycle of manufacturing workflows.
Define material specifications and collaborate closely with supplier quality and procurement teams to maintain compliance with quality and performance benchmarks.
Leverage a deep understanding of failure mechanisms to establish reliability benchmarks aligned with customer requirements.
Lead problem-solving initiatives and champion continuous improvement efforts for media and collaterals.
Standardize manufacturing qualification practices and quality systems while managing technical risks in alignment with product milestones and supplier delivery schedules.
Serve as a subject matter expert, providing technical consultation to internal teams and external partners on media and collateral solutions.
As a Successful Candidate, You Will Bring: Collaborative mindset – You thrive in cross-functional team environments and build strong relationships with colleagues, suppliers, and partners.
Analytical thinking – You approach complex problems with a structured, data-driven mindset and a passion for finding root causes.
Effective communication – You can clearly articulate technical concepts to both technical and non-technical audiences, both verbally and in writing.
Adaptability – You are comfortable navigating ambiguity and shifting priorities in a fast-paced, innovation-driven environment.
Attention to detail – You take pride in precision and thoroughness, ensuring quality and accuracy in everything you do.
Initiative & ownership – You proactively identify opportunities for improvement and take ownership of outcomes from start to finish.
Resilience – You remain focused and solution-oriented when faced with challenges or setbacks.
Are you ready to make your mark on the future of semiconductor packaging? Join Intel's team of world-class innovators in Arizona and help redefine what's possible in next-generation packaging technologies. Apply today and take the next step in your engineering career at one of the most iconic technology companies in the world.

Packaging Process Development Engineer

Employer job description

Job Details:

Job Description:

Key Responsibilities:

Qualifications:

Minimum Qualifications:

Preferred Qualifications:

Additional Locations:

Posting Statement:

Benefits

About this listing

Listing check

Similar jobs

Similar jobs