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Richardson, TX
Source: Micron careers · View original posting
From Micron's posting. “We” and “our” refer to the employer.
Our vision is to transform how the world uses information to enrich life for all .
Micron Technology is a world leader in innovating memory and storage solutions that accelerate the transformation of information into intelligence, inspiring the world to learn, communicate and advance faster than ever.
The High-Performance Integrated Group (HIG) is a division within the Technology and Products Group (TPG). We are dedicated to developing and optimizing High Bandwidth Memory (HBM) solutions for AI and ML applications! Our ultimate goal is to deliver the lowest power per bit solutions in the industry!
We are searching for an HBM IO Design Architecture Engineer. This role will focus on HBM IO / TSV IO design and analysis including electrical modeling, Signal Integrity (SI) and Power Integrity (PI) analysis, and design optimization across the HBM development cycle.
The ideal candidate brings hands-on experience in design execution, simulation to silicon correlation, and cross-functional methodology development, and embraces AI-driven analysis and data-driven decision making to accelerate quality improvement cycles.
LAYIQ is an independent job-discovery service. This listing does not imply a partnership with or endorsement by the employer. Review the original posting for current details and availability.
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