layiq

/la·yiq/adjective

worthy; deserving; fitting; suitable.

A role, opportunity, or path that merits attention, time, and pursuit.

LAYIQ - Packaging Design Engineer at AMD, Austin, TX

Responsibilities

THE ROLE:

We are seeking a Package Design Engineer to support complex package design execution. This role requires a self-driven technical expert who thrives in a fast-paced, dynamic, and high-pressure environment, and can deliver high-quality designs with speed, precision, and scalability.

The successful candidate will play a key role in advancing AMD’s packaging methodologies by leveraging

AI-driven design techniques, automation, and next-generation workflows to address the increasing complexity of heterogeneous integration and advanced packaging architectures.

THE PERSON:

The ideal candidate is an experienced package or silicon physical designer who:

Demonstrates strong ownership and accountability across multiple programs

Excels in fast-phase execution environments with competing priorities

Applies

AI/ML and automation to improve design productivity and quality
Operates with minimal supervision while influencing cross-functional teams
Balances deep technical expertise with strong collaboration and communication skills

KEY RESPONSIBILITIES:

Design Execution & Technical Leadership
Perform end-to-end package design execution for complex products, ensuring performance, cost, quality, and schedule targets are met
Handle multiple concurrent design programs in a fast-paced and high-pressure environment
Develop substrate layouts, bump maps, and interposer designs for advanced packaging (2.5D/3D, chiplet-based architectures)
Drive design decisions through close collaboration with SI/PI, mechanical, and SOC teams
Cross-Functional Collaboration
Partner with internal engineering teams, OSATs, and substrate suppliers to deliver optimized solutions
Interface with stakeholders to communicate design status, risks, and mitigation strategies
Contribute to design reviews, signoff readiness, and tapeout processes
Methodology & Continuous Improvement
Define and enhance package design methodologies, flows, and best practices
Drive improvements in layout efficiency, reuse, and design standardization
PREFERRED EXPERIENCE: Designing complex substrate design or Silicon Bridge or Interposers
Proven ability to execute in multi-project, fast-phased, and high-pressure environments
Strong experience in advanced packaging technologies:
Hands-on experience with EDA tools such as: Experience working with OSATs, foundries, and substrate vendors
Solid understanding of Signal Integrity and Power Integrity fundamentals
ACADEMIC CREDENTIALS: Bachelor’s or higher degree in Electrical Engineering, Computer Engineering, or related field
This role is not eligible for visa sponsorship.

Packaging Design Engineer

Employer job description

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KEY RESPONSIBILITIES:

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Responsibilities

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