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US, Arizona, Phoenix; USA - AZ - Chandler
Source: Intel careers · View original posting
From Intel's posting. “We” and “our” refer to the employer.
Intel Corporation is one of the world's leading semiconductor companies, driving innovation that shapes the future of computing, connectivity, and intelligence. With decades of engineering excellence and a commitment to pushing the boundaries of what's possible, Intel develops the technologies that power everything from personal devices to data centers and AI systems. At Intel, we believe in the power of human ingenuity — and we're looking for bold, curious minds to help us build what's next.
Are you passionate about semiconductor innovation and ready to make a real impact from day one? Intel's Epoxy MEOS team in Arizona is looking for a Packaging Module Development Engineer to join our growing team of packaging technology experts. In this role, you will be at the forefront of developing and optimizing cutting-edge assembly and packaging processes that directly influence the quality, reliability, and performance of Intel's next-generation semiconductor products.
This is an exciting opportunity for an early-career engineer who is eager to apply their academic knowledge in a world-class manufacturing and engineering environment, contribute to meaningful projects, and grow alongside some of the brightest minds in the semiconductor industry.
Shift Information
This role operates on Shift 4: 6:00 PM – 6:00 AM on an alternating weekly schedule:
(nights frontend) Sun-Tues and alternating Saturday nights
All qualified applicants will receive consideration for employment without regard to race, color, religion, religious creed, sex, national origin, ancestry, age, physical or mental disability, medical condition, genetic information, military and veteran status, marital status, pregnancy, gender, gender expression, gender identity, sexual orientation, or any other characteristic protected by local law, regulation, or ordinance.
Position of Trust
N/A
Annual Salary Range for jobs which could be performed in the US: $85,200.00-162,500.00 USD
The range displayed on this job posting reflects the minimum and maximum target compensation for the position across all US locations. Within the range, individual pay is determined by work location and additional factors, including job-related skills, experience, and relevant education or training. Your recruiter can share more about the specific compensation range for your preferred location during the hiring process.
Work Model for this Role
This role will require an on-site presence. * Job posting details (such as work model, location or time type) are subject to change.
ADDITIONAL INFORMATION: Intel is committed to Responsible Business Alliance (RBA) compliance and ethical hiring practices. We do not charge any fees during our hiring process. Candidates should never be required to pay recruitment fees, medical examination fees, or any other charges as a condition of employment. If you are asked to pay any fees during our hiring process, please report this immediately to your recruiter.
LAYIQ is an independent job-discovery service. This listing does not imply a partnership with or endorsement by the employer. Review the original posting for current details and availability.
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